MaterialsBase-materialFR4, CEM-3, high frequency, PTFE, halogen-free, Aluminium base material, Copper based material
Material brandKB, ITEQ, SY, ISOLA, Rogers, Arlon, Ventec,     Laird, or other laminate on customer’s request.
Min. core thickness3 mil
Prepreg1080 , 2116 , 7628 , 7630
Copper foil1/4 oz ~6 oz
Solder maskRongda,Taiyo,Nanya or other brand on customer’s request
HoleMin. drill size0.2mm
Min laser drill size3mil
Hole diameter tolerance±0.05mm
Hole location tolerance±2mil
Image transfermin line width/space3/3 mil
Finished copper thickness6 oz
Layer to layer registration2 mil
EtchingLine width/space tolerance±10%
Solder MaskVia plugvia size :0.2-0.8mm
S/M registration1 mil
solder dam width4 mil
HAL (Pb-free)YES
Immersion silverYES
Immersion TinYES
Gold fingerYES
Immersion goldYES
ProductLayer count1~20 layers
Board thickness0.3 ~ 6 mm
Board thickness tolerance± 5%
max board size800*650mm
min V-score residuals0.1 mm
Bow & twist≤0.50% (max cap)
Outline tolerance± 0.1mm
Impedance control PCBYES
Blind and buried via PCBYES(laser and mechanical drill)
High frequency PCBYES
Selective hard gold PCBYES
Carbon ink PCBYES
Aluminium base PCBYES
FeatureParameter (in)Parameter (mm)
Layers1 – 61 – 6
Max Board Size20” x 20”508 x 508mm
BrandITEQ, DuponITEQ, Dupon
Min Board Thickness – 1-2 (layers)6mil0.15mm
Min Board Thickness – 4 (layers)8mil0.2mm
Min Board Thickness – 6 (layers)10mil0.25mm
Board Thickness Range6 – 25mil0.15 – 0.63mm
Max Copper Thickness2oz70um
Min Line Width / Space2mil / 2mil0.05 / 0.05mm
Min Hole Size3mil0.075mm
PTH Dia. Tolerance±2mil±0.05mm
NPTH Dia. Tolerance±1mil±0.025mm
Hole Position Deviation±4mil±0.1mm
Outline Tolerance±3mil±0.075mm
S/M Pitch3mil0.075mm
Aspect Ratio0.2506944440.250694444
Thermal Shock5 x 10Sec @2885 x 10Sec @288
Impedance Control±5%±5%
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