| Items | Capabilities |
|---|---|
| Material | FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc |
| Material Brands | KB, ITEQ, SY, Panasonic, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Taconic, or other laminate on customer's request |
| Layer Count | 1-40 |
| Flammaility | UL 94V-0 |
| Quality Standards | IPC Classes 2/3 |
| HDI Build-up | Any Layer, up to 4+N+4 |
| Max Length | 1200mm |
| Board Thickness | 0.1~7mm |
| Min Thickness | 2-layer: 0.1mm 4-layer: 0.4mm 6-layer: 0.6mm 8-layer: 0.8mm 10-layer: 1mm More than 10 layers: 0.5*Layer Count*0.2mm |
| Copper Thickness | 0.5-20oz, Max to 33oz |
| Solder Mask | White, Black, Green, Blue, Red, Yellow, Orange, Purple, Matte Green, Matte Black; Carbon Ink |
| Solder Mask Thickness | 0.2mil-1.6mil |
| Solder Mask Dam | 4mil |
| Surface Finishes | Bare Copper, Hasl lead-free, Carbon Ink, ENIG, Gold Fingers, OSP, IAg, ISn, etc |
| Plating Thickness | HASL: Copper Thickness: 20-35um Tin: 5-20 um Immersion Gold: Nickel: 100u"-200u" Gold: 2u" -4u" Hard Plated Gold: Nickel: 100u"-200u" Gold: 4u"-8u" Golden Finger: Nickel: 100u"-200u" Gold: 5u"-15u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
| Min Hole Size | 0.08mm |
| Min Trace Width/Spacing | 2mil/2mil |
| Minimum Solder Mask Clearance | 2mil |
| Min Annular Ring | 4mil |
| Min Pad to Pad Clearance | 2mil |
| Via Plugging | 0.2~0.8mm |
| Line Width/Space Tolerance | ±10% |
| Board Thickness Tolerance | ±5% |
| Hole Diameter Tolerance | ±0.05mm |
| Hole Location Tolerance | ±2mil |
| Layer to Layer Registration | 2mil |
| S/M Registration | 1mil |
| Aspect Ratio | 25:1, Max to 40:1 |
| Blind Vias Aspect Ratio | 0.7:1, Max to 1:1 |
| Outline Tolerance | ±0.1mm |
| V- CUT Tolerance | ±10mi |
| Bevel Edge | ± 5mil |
| Warp and Twist | ≤0.50% (max cap) |
| Quality Test | AOI, 100% E-test |
| Value-Added Services | DFM Check, Expedited Production |
| Featured Processes | Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, etc |
| Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |
| Items | Capabilities |
|---|---|
| Material | PI, PET, PEN, FR-4, Dupont |
| Layer Count | Flex Board: 0.15–0.63mm Rigid-flex Board: 0.06-4.0mm |
| Flammaility | UL 94V-0 |
| Quality Standards | IPC Classes 2/3 |
| Max Board Dimension | 508*508mm |
| Finish Thickness | Flex Board: 0.1–0.63mm Rigid-flex Board: 0.06-4.0mm |
| Copper Thickness | 1/3-20oz |
| Stiffener Material | Polyimide/FR4/Metal |
| Cover Film | Black, Yellow |
| Solder Mask Dam | 4mil |
| Surface Finishes | ENIG, Gold Fingers, ENEPIG, Electrolytic Wire Bondable Gold, OSP, IAg, ISn, etc |
| Plating Thickness | Immersion Nickel/Gold: Nickel: 100u"-200u" Gold: 1u"-5u" Gold Plating: Nickel: 100u"-200u" Gold: 1u"-4u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
| Min Hole Size | 0.08mm |
| Min Trace Width/Spacing | 2mil/2mil |
| Minimum Solder Mask Clearance | 3mil |
| Min Annular Ring | 4mil |
| Board Thickness Tolerance | ±5% |
| Hole Diameter Tolerance | ±2mil |
| Hole Location Tolerance | ±4mil |
| Outline Tolerance | ±3mil |
| Aspect Ratio | 25:1, Max to 40:1 |
| Quality Test | AOI, 100% E-test |
| Value-Added Services | DFM Check, Expedited Production |
| Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |
| Items | Capabilities |
|---|---|
| Material | Aluminum Base, Copper Base, FR4 (140Tg, 170Tg, 180Tg), CEM-1, CEM-3, Ceramic, FR4+Aluminum |
| Material Brands | KB, ITEQ, SY, ISOLA, Arlon, Ventec, Laird, Bergquist, DENKA, Panasonic, or other laminate on customer's request |
| Layer Count | 1~6 |
| Thermal Conductivity | 1W-300W/mk |
| Flammaility | UL 94V-0, FV-0 |
| Quality Standards | IPC Classes 2/3 |
| Thickness | 0.2~7mm |
| Copper Thickness | 0.5-10oz |
| Solder Mask | White, Black, Green, Super White/Solar/Carbon Ink |
| Solder Mask Thickness | 10-12μm |
| Solder Mask Dam | 4mil |
| Surface Finishes | Bare Copper, Hasl lead-free, ENIG, Gold Fingers, OSP, IAg, ISn, etc |
| Max Length | 1500mm |
| Min Hole Size | 0.2mm |
| Min Trace Width/Spacing | 3mil/3mil |
| Minimum Solder Mask Clearance | 2mil |
| Min Annular Ring | 4mil |
| Min Pad to Pad Clearance | 2mil |
| Via Plugging | 0.2~0.8mm |
| Line Width/Space Tolerance | ±10% |
| Board Thickness Tolerance | ±5% |
| Hole Diameter Tolerance | ±0.05mm |
| Hole Location Tolerance | ±2mil |
| Layer to Layer Registration | 2mil |
| S/M Registration | 1mil |
| Aspect Ratio | 25:1, Max to 40:1 |
| Outline Tolerance | ±0.1mm |
| Bow & Twist | ≤0.50% (max cap) |
| Quality Test | AOI, 100% E-test |
| Value-Added Services | DFM Check, Expedited Production |
| Featured Processes | COB Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Peelable Solder Mask, etc |
| Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |